High performance computing manufacturers are increasingly deploying liquid cooling in their systems. The engineers responsible for thermal management, therefore, are drilling down into the components that facilitate optimal cooling. Liquid cooling system components must meet requirements for chemical compatibility, flow rates, and temperature and pressure exposures. Ease of use and reliability over long periods of time are desirable attributes as well.
Considerations related to connectors include install torque, seal-ability and vibration and shock resistance. Quick disconnects (QDs) designed and built specifically for HPC and data center applications are now available, simplifying connector selection. Questions remain, however, around which of the many termination options are most appropriate for liquid cooling systems. Intended use, ease of installation and maintenance, operating conditions, durability, and potential for leakage all have bearing on the selection process.
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