Direct-to-chip cooling is becoming an increasingly attractive data center cooling strategy.

British chip designer is laying off most of its staff and discontinuing sales in China.

Conglomerate plans to develop a semiconductor assembly and test facility over the next five years.

Biden administration is expected to shift competitive focus to advanced semiconductor packaging.

New chip designs are changing the way AI workloads are processed, including an analog chip that improves computer vision.

Chinese multinational walks back plans to spin off its cloud business as US chip restrictions take hold.

CEO Satya Nadella discussed Microsoft’s AI developments, commitment to sustainability, and strategic partnerships.

The Maia 100 chip will provide Azure cloud customers with a new way to develop and run AI programs.

The Hybrid Mechanical Capillary-Drive Two-Phase Loop seeks to make traditional cooling a thing of the past.

The H200 chip has high-bandwidth memory that allows it to cope with the large data sets needed for AI.