Many data center operators have managed heat density issues by spreading the load and under populating racks. This has come about because of the limitations of air cooling, which can create a very costly, complex, and inefficient infrastructure. This white paper explains how localized, passive, low-power dissipation liquid cooling devices at either rack level or rack proximity, when compared to traditional air-cooled methods, offers the opportunity to reduce the power consumption of in-room cooling devices by as much as 90 percent.
Liquid-cooling technology also permits a “pay as you go” cooling implementation, saving significant CapEx when constructing a new data center. Present air-cooled data center construction requires an implementation from “day 1” of all the cooling hardware for proper operation of the IT room. Localized liquid cooling would be implemented with IT expansion. Cooling hardware is modular and is purchased at the same rate as the IT hardware.
This white paper from Coolcentric addresses the emergence of localized liquid cooling, rack level or rack proximity, as the basis of data-center design, which will provide the most effective, efficient, and sustainable method to cool today’s high-performance data centers. Click here to download this white paper.