Posted By Rich Miller On July 6, 2010 @ 8:38 am In Uncategorized | 2 Comments
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This illustration of the heat sink provides a view of the grooves where processors for the motherboards would fit onto either side, allowing the heat sink to cool two motherboards at once. The circles represent the pipes for cooling loops inside the heat sink.
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[1] “server sandwich”: http://www.datacenterknowledge.com/archives/2010/07/06/google-patents-liquid-cooled-server-sandwich/
[2] Image: http://www.datacenterknowledge.com/wp-content/uploads/2010/06/google-patent-rack.jpg
[3] Image: http://www.datacenterknowledge.com/wp-content/uploads/2010/06/google-patent-cross-section.jpg
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