AMD Adds New Embedded Low-Power Chip

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AMD announced a new low-power Accelerated Processing Unit (APU) in the G-Series SoC family. The new GX-210JA APU, a full System-on-Chip (SoC) design, uses one-third less energy than the previous low-power Embedded G-Series SOC at 6 watts maximum thermal design power (TDP), and approximately 3 watts expected average power.

“The advance of APU processor design, the Surround Computing era, and ‘The Internet of Things’ has created the demand for embedded devices that are low power but also offer excellent compute and graphics performance,” said Arun Iyengar, vice president and general manager, AMD Embedded Systems. “AMD Embedded G-Series SOC products offer unparalleled compute, graphics and I/O integration, resulting in fewer board components, low-power use, and reduced complexity and overhead cost. The new GX-210JA operates at an average of approximately 3 watts, enabling a new generation of fan-less designs for content-rich, multimedia and traditional workload processing.”

The GX-210JA is part of the AMD Embedded G-Series SOC processor family, which features ECC memory support, industrial temperature ranges, discrete-class AMD Radeon GPU and an integrated I/O controller. The new GX-210JA is currently shipping.

“AMD multi-core APUs have played a key role in powering our latest cloud client platforms with excellent performance in an extremely compact and efficient form factor,” said Kiran Rao, director of Hardware Platforms, Dell Wyse. 

“As the newest dual-core member of the AMD Embedded G-Series SOC family, the AMD GX-210JA offers the right level of performance, low-energy use, I/O integration and operating system support, plus a small footprint that should further simplify build requirements,” Rao noted.

About the Author

John Rath is a veteran IT professional and regular contributor at Data Center Knowledge. He has served many roles in the data center, including support, system administration, web development and facility management.

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