The Cooling Channel is brought to you by: Opengate Data Systems

  • Roundup: Corning, Tripp Lite, Emerson

    • By: Tom Miller
      June 19th, 2009

    Here’s a roundup of data center industry news from this week:

    • Corning Incorporated (GLW) announced a new “bend-insensitive” optical fiber data center solution. Corning’s Clearcurve features a reduced cable diameter that the company says will allow trunk cables and jumpers to be quickly routed through tight spaces with no impact on system performance.
    • Tripp Lite has introduced a new wall-mount rack enclosure. The new SmartRack Enclosure enables rackmounting in remote locations or any facility not requiring full-sized rack enclosures. The SRW12US enclosure provides 12U of rack space, and includes an optional caster kit which allows it to become a mobile floor-unit.
    • Emerson Network Power (EMR) has expanded its Liebert XD family of high-density cooling solutions with XD Smart Modules, which add cooling modules with integrated control boards which would enable higher efficiency performance.
    • Add Your Comments

Sign up for the
Data Center Knowledge Newsletter

Submit

Get daily email alerts direct to your inbox.

ARCHIVED ARTICLES